Automatic Wafer ( Horizontal ) Plating Machine

Product Description: Automatic Wafer (Horizontal) Plating Machine

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Introduction:The Automatic Wafer (Horizontal) Plating Machine is a state-of-the-art solution designed for high-precision electroplating of semiconductor wafers in a horizontal orientation. Engineered for efficiency and scalability, this machine is ideally suited for the production of integrated circuits, MEMS devices, and other semiconductor applications. Its advanced features ensure consistent plating thickness and quality, catering to the demands of modern semiconductor manufacturing.

Key Specifications:

• Materials: Constructed with high-grade stainless steel and corrosion-resistant alloys to ensure durability and longevity.
• Dimensions: Compact footprint with a width of 2 meters, depth of 1.5 meters, and height of 1.8 meters. Weight: 1,200 kg.
• Capacity: Can accommodate wafers ranging from 200 mm to 300 mm in diameter, with a plating capacity of up to 150 wafers per hour.

Unique Features:

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• AI Integration: Equipped with advanced AI algorithms for real-time monitoring and adjustment of plating parameters, ensuring optimal performance.
• Smart Automation: Features a fully automated loading and unloading system, minimizing manual intervention and enhancing operational efficiency.
• User-Friendly Interface: Intuitive touchscreen control panel for easy operation and monitoring, complete with data logging and reporting capabilities.
• Temperature and pH Control: Precise regulation of bath temperature and chemical composition, allowing for consistent plating results.

Performance:

• Efficiency: Achieves up to 98% material utilization, significantly reducing waste and lowering production costs.
• Speed: Plating speeds of up to 30 micrometers per minute, enabling high throughput without compromising quality.
• Reliability: Designed for continuous operation, with minimal downtime and maintenance requirements.

How It Solves Problems:The Automatic Wafer (Horizontal) Plating Machine addresses key challenges in semiconductor fabrication, including inconsistent plating quality and long cycle times. By utilizing AI-based control systems and smart automation, it streamlines the plating process, allowing manufacturers to achieve higher yields and reduce production costs. Additionally, the machine’s robust construction and precision engineering ensure long-term reliability, making it an essential investment for companies looking to enhance productivity and maintain competitive advantage in the evolving semiconductor market.

Harness the power of advanced plating technology with our Automatic Wafer (Horizontal) Plating Machine—where precision meets efficiency!

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