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Automatic Wafer ( Horizontal ) Plating Machine

Product Description: Automatic Wafer (Horizontal) Plating Machine

Product Description

Product Description: Automatic Wafer (Horizontal) Plating Machine

With competitive price and timely delivery, JYN sincerely hope to be your supplier and partner.

Unlock the future of semiconductor manufacturing with our state-of-the-art Automatic Wafer (Horizontal) Plating Machine. Engineered to perfection, this innovative solution is designed for high-precision plating of wafers, ensuring seamless integration into your production line while maximizing efficiency and quality.

Key Specifications:

  • Wafer Size Capacity: Supports wafers up to 300mm in diameter.
  • Plating Thickness: Adjustable from 1µm to 10µm, allowing for precise control over deposition.
  • Processing Speed: Achieves plating cycles in as little as 20 seconds, drastically reducing turnaround time.
  • Temperature Control: Advanced thermal management system with a range of 20°C to 70°C to enhance process consistency.
  • Chemical Compatibility: Designed to work with a variety of electroplating solutions, ensuring versatility for different applications.
  • User Interface: Intuitive touchscreen with real-time monitoring and control for effortless operation.

Why Choose Our Automatic Wafer Plating Machine?

  1. Unmatched Precision: Our machine utilizes cutting-edge robotics coupled with advanced optical sensors, guaranteeing that every wafer is plated uniformly, significantly reducing defects and rework.

  2. High Efficiency: With a compact footprint and fast cycle times, this machine maximizes your production capacity without compromising on quality. Experience lower operational costs and higher yields.

  3. Seamless Integration: Specifically designed for easy integration into existing systems, minimizing downtime and facilitating smooth transitions for your workforce.

    JuYongNeng supply professional and honest service.

  4. Robust Data Management: Leverage our comprehensive data analytics software that monitors every aspect of the plating process. It provides invaluable insights for continuous improvement and compliance with industry standards.

  5. Environmentally Friendly: Equipped with a sustainable waste management system, our machine helps you meet environmental regulations while reducing your carbon footprint.

Applications:Perfect for a wide range of industries, including:

  • Semiconductor manufacturing
  • Solar panel production
  • Advanced circuit board fabrication
  • MEMS (Micro-electro-mechanical systems)

Customer-Centric Solutions:We understand the needs of modern manufacturers. Our Automatic Wafer Plating Machine not only enhances operational efficiency but also aligns with your quality standards and environmental commitments. Each machine is backed by our exceptional customer service, offering training, support, and dedicated consultation to ensure you achieve the best results.

Conclusion:Transform your plating process with our Automatic Wafer (Horizontal) Plating Machine — where innovation meets reliability. Elevate your production capabilities, reduce costs, and stay ahead of the competition. Contact us today to learn more about how our solutions can meet your operational needs and to request a personalized demo that showcases the extraordinary capabilities of our machine.

Don’t just keep up with the industry standards; set them. Experience the difference today!

Related Products:Automatic Wafer ( Horizontal ) Plating Machine

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